document number: 28797 for technical questions, contact: fuse@vishay.com www.vishay.com revision: 26-may-10 1 tfu 0603 vishay beyschlag thick film chip fuses tfu 0603 thick film chip fuse is the best choice for the most fields of modern electronics. the controlled manufacturing process guarantees stable fusing characteristics in standard applications of information technology, telecommunication, and audio/video electronics. features ? proven thick film technology ? very quick acting fuse characteristics ? standard smd size ? lead (pb)-free solder contacts ? halogen-free according to iec 61249-2-21 definition ? compliant to rohs directive 2002/95/ec applications ? information technology ? telecommunication ? audio/video electronics size inch 0603 metric 1608m technical specifications description tfu 0603 metric size 1608m rated current range i r 2.0 a to 4.0 a rated voltage, u max. dc 32 v; 24 v interrupting rating, i max. at u max. dc 35 a cold resistance at 0.1 x i r 19 m to 61 m climatic category (lct/uct/days) 55/125/56 permissible continuous current rating at ? amb = 23 c 0.7 x i r ul recognition file e335924
www.vishay.com for technical questions, contact: fuse@vishay.com document number: 28797 2 revision: 26-may-10 tfu 0603 vishay beyschlag thick film chip fuses notes (1) products can be ordered using either the part number or the product description part number and product description (1) part number: tfu0603ff04000p500 model/size fuse characteristic rated current value packaging special tfu0603 ff = very quick acting rated current value in ma. example: 4.0 a = 04000 p1 p5 pw up to 2 digits 00 = standard product description: tfu 0603-ff p5 4a0 tfu 0603 -ff p5 4a0 model size fuse characteristic packaging rated current value tfu 0603 ff = very quick acting p1 p5 pw rated current value in ma. example: 4.0 a = 4a0 packaging model reel diameter pieces/reel code tfu 0603 180 mm/7" 1000 p1 180 mm/7" 5000 p5 330 mm/13" 20 000 pw t f u 0 6 0 3 f f 0 4 0 0 0 p 5 0 0
document number: 28797 for technical questions, contact: fuse@vishay.com www.vishay.com revision: 26-may-10 3 tfu 0603 thick film chip fuses vishay beyschlag dimensions solder pad dimensions note ? the given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards iec 611 88-5-x, or in publication ipc-7351. they do not guarantee any supposed thermal pr operties, particularly as thes e are also strongly influenced by many other parameters. notes (1) typical values (2) for packages with 1000 pieces, pleas e use for packing p1 instead of p5 (3) for packages with 20 000 pieces, please use for packing pw instead of p5 dimensions - mass and relevant physical dimensions type h (mm) l (mm) w (mm) w t (mm) t 1 (mm) t 2 (mm) mass (mg) tfu 0603 0.45 + 0.1/- 0.05 1.55 0.1 0.85 0.1 > 0.55 0.3 + 0.15/- 0.2 0.45 + 0.15/- 0.2 2.3 recommended solder pad dimensions type wave soldering reflow soldering g (mm) y (mm) x (mm) z (mm) g (mm) y (mm) x (mm) z (mm) tfu 0603 0.55 1.10 1.10 2.75 0.65 0.75 0.95 2.15 tfu 0603 rating - very quick acting (ff) size fuse char. rated current rated voltage u max. dc cold resistance (1) at 0.1 x i r interrupting rating dc marking approval part number (2)(3) 0603 ff 2.0 a 32 v 61 m 35 a at 32 v n ul tfu0603ff02000p500 2.5 a 32 v 44 m 35 a at 32 v o ul tfu0603ff02500p500 3.0 a 24 v 32 m 35 a at 24 v p ul tfu0603ff03000p500 3.5 a 24 v 26 m 35 a at 24 v r ul tfu0603ff03500p500 4.0 a 24 v 19 m 35 a at 24 v s ul tfu0603ff04000p500 t 2 t 1 l h w w t g x y z
www.vishay.com for technical questions, contact: fuse@vishay.com document number: 28797 4 revision: 26-may-10 tfu 0603 vishay beyschlag thick film chip fuses description production is strictly controlled and follows an extensive set of instructions established for reproducibility. a mixed film of high conductive particles is deposited on a high grade ceramic body. the fuse elements are covered by a protective coating designed for electrical, mechanical and climatic protection. the terminations receive a final pure tin layer. the result of the determined production is verified by an extensive testing procedure performed on 100 % of the individual fuses. only accepted products are laid directly into the paper tape in accordance with iec 60286-3. assembly the fuses are suitable for processing on automatic smd assembly systems. they are suitable for automatic soldering using wave, reflow or vapour phase. the encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. the fuses are lead (pb)-free (category e3 ), the pure tin plating provides compatibility with lead (pb)-free and lead-containing soldering processes. solderability is specified for 2 years after production or requalification. the permitted storage time is 5 years. all products comply with the cefic-eeca-eicta list of legal restrictions on hazardous substances. this includes full compatibility with the following directives. ? 2000/53/ec end of vehicle life directive (elv) and annex ii (elv ii) ? 2002/95/ec restriction of the use of hazardous substances directive (rohs) ? 2002/96/ec waste electrical and electronic equipment directive (weee) approvals the fuses are tested in accordance with ul 248-14, iec 60127-4 and iec 60068 series. approval of recognition is indicated by the ul logo on the package label.
document number: 28797 for technical questions, contact: fuse@vishay.com www.vishay.com revision: 26-may-10 5 tfu 0603 thick film chip fuses vishay beyschlag functional performance note (1) fuses mounted on a test board according to iec 60127-4 typical t pre-arc vs. i characteristic of tfu 0603 (1) typical i 2 t vs. t pre-arc characteristic of tfu 0603 (1) 100 10 -4 1 current i (a) pre-arc time t pre-arc (s) 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 10 4 tfu 0603-ff 4.00 a 3.50 a 3.00 a 2.50 a 2.00 a 10 tfu 0603-ff 4.00 a 3.50 a 3.00 a 2.50 a 2.00 a 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 10 4 pre-arc time t pre-arc (s) joule integral l 2 t (a 2 s) 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2
www.vishay.com for technical questions, contact: fuse@vishay.com document number: 28797 6 revision: 26-may-10 tfu 0603 vishay beyschlag thick film chip fuses tests and requirements all tests are carried out in accordance with the following specifications: ul/csa 248-14, low voltage fuses - part 14: supplemental fuses iec 60127-4, universal modular fuse links (umf) for the full test schedule refer to the documents listed above. the testing also covers most of the requirements specified by meti and ccc. the tests are carried out in accordance with iec 60068 and under standard atmospheric cond itions in accordance with iec 60068-1, 5.3. climatic category lct/uct/56 (rated temperature range: lower category temperature, upper category temperature; damp heat, long term, 56 days) is valid. unless otherwise specified the following values apply: temperature: 15 c to 35 c relative humidity: 45 % to 75 % air pressure: 86 kpa to 106 kpa (860 mbar to 1060 mbar) the components are mounted for testing on printed-circuit boards in accordance with iec 60127-4, unless otherwise specified. the requirements stated in the test procedures and requirements table are based on the required tests and permitted limits of ul 248-14 and iec 60127-4 respectively. however, some additional tests and a number of improvments against those minimum requirements have been included. test procedures and requirements ul/csa 248-14 iec 60068-2 test method test procedure requirements permissible change -21 (ue 1 ) substrate bending depth 3 mm; rate 1 mm/s 1 time no visible damage; r / r 15 % - 58 (td) solderability solder bath method; snpb40; non-activated flux; (215 3) c; (3 0.3) s good tinning ( 95 % covered); no visible damage solder bath method; snag3cu0.5 or snag3.5; non-activated flux; (235 3) c; (2 0.2) s good tinning ( 95 % covered); no visible damage resistance to soldering heat solder bath method; (260 5) c; (10 1) s no visible damage; r / r 15 % reflow method 2 ( i r /forced gas convection); (260 5) c; (10 1) s no visible damage; r / r 15 % - - time/current characteristics at nominal temperature destructive testing under overcurrent conditions (dc-current) at 2.0 x i r , t pre-arc < 60 s at 2.5 x i r , t pre-arc < 5 s 5.5 - interrupting rating (dc) 35 a at rated voltage optical inspection with naked eye; no visible damage - - endurance test acc. to iec 60127-4, clause 9.4 a) i = 1.0 x i r (dc) 1.0 h on; 0.25 h off; 23 c; 100 times b) i = 1.25 x i r (dc) 1.0 h on 23 c; 1 time no visible damage; r / r 15 % 8.2.3 - verification of temp.-rise and current-carrying capacity i = 1.0 x i r (dc) temperature rise of hot spot 75 k acc. to ul 248-14, clause 8.2.4 - - time/current characteristics at elevated temperature. iec 60127-1, clause 9.2.2 i = 1.1 x i r (dc) at 70 c; 1.0 h no visible damage; r / r 15 %
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